The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2026
Filed:
Jun. 02, 2023
Applicant:
Knauf Gips KG, Iphofen, DE;
Inventors:
Alexander J. Donovan, North Chelmsford, MA (US);
Naveen Punati, Kildeer, IL (US);
Assignee:
KNAUF GIPS KG, Iphofen, DE;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C04B 28/14 (2006.01); C04B 11/02 (2006.01); C04B 14/10 (2006.01); C04B 14/20 (2006.01); C04B 14/28 (2006.01); C04B 24/06 (2006.01); C04B 24/26 (2006.01); C04B 24/38 (2006.01); C04B 38/10 (2006.01); C04B 40/00 (2006.01); C04B 40/06 (2006.01); C04B 103/00 (2006.01); C04B 103/12 (2006.01); C04B 103/40 (2006.01); C04B 103/48 (2006.01); C04B 111/00 (2006.01); C04B 111/40 (2006.01); E04F 21/02 (2006.01);
U.S. Cl.
CPC ...
C04B 28/146 (2013.01); C04B 11/02 (2013.01); C04B 14/102 (2013.01); C04B 14/20 (2013.01); C04B 14/28 (2013.01); C04B 24/06 (2013.01); C04B 24/2623 (2013.01); C04B 24/383 (2013.01); C04B 38/10 (2013.01); C04B 40/0032 (2013.01); C04B 40/0042 (2013.01); C04B 40/0641 (2013.01); E04F 21/026 (2013.01); C04B 2103/0079 (2013.01); C04B 2103/12 (2013.01); C04B 2103/40 (2013.01); C04B 2103/48 (2013.01); C04B 2111/00637 (2013.01); C04B 2111/40 (2013.01); C04B 2201/20 (2013.01);
Abstract
Perlite-free, lightweight setting-type joint compounds which comprise calcium sulfate hemihydrate with a dry density of less than 50 lb/ft, a foaming agent having a HLB value of at least 10 and preferably comprising an alkylbenzene sulfonic acid having a linear alkyl chain containing 8 to 14 carbons and/or a salt thereof, and a combination of rheology modifiers. Methods for building wallboard assemblies and methods for wall patch and repair projects that include applying the perlite-free, lightweight setting-type joint compounds to a substrate.