The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2026

Filed:

Jul. 29, 2020
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Barbara Will, Herrenberg, DE;

Juergen Butz, Reutlingen, DE;

Ricardo Zamora, Stuttgart, DE;

Timo Kuhn, Eningen, DE;

Assignee:

ROBERT BOSCH GMBH, Stuttgart, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); G03F 7/36 (2006.01); G03F 7/40 (2006.01); G03F 7/42 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00476 (2013.01); G03F 7/36 (2013.01); G03F 7/40 (2013.01); G03F 7/427 (2013.01); B81C 2201/11 (2013.01);
Abstract

A method for locally removing/modifying a polymer material on a surface of a wafer. The method includes: a) aligning a mask with respect to the surface; b) locally exposing the surface through the mask using a VUV light source while simultaneously supplying a gas mixture containing at least oxygen; c) purging the surface with a gas mixture containing at least nitrogen and oxygen, the VUV light source being switched off; and d) repeating at least steps b) and c) until the removal/modification is complete. A device is described for locally removing/modifying a polymer material on a surface of a wafer, including a mask. The device includes an adjustable wafer table for holding the wafer, and is configured to set an exposure gap between the wafer and the mask in a first operating state, and to set a purge gap between the wafer and the mask in a second operating state.


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