The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2026

Filed:

Oct. 04, 2021
Applicant:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Takuto Hidani, Osaka, JP;

Kousuke Miura, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/00 (2006.01); B32B 15/08 (2006.01);
U.S. Cl.
CPC ...
B32B 15/00 (2013.01); B32B 15/08 (2013.01);
Abstract

A base material for a printed circuit of the present disclosure includes a base film containing polyimide as a main component, and a conductor layer formed on at least one surface of the base film. The conductor layer includes a metal sintered layer formed on the base film and an electroless plating layer formed on the metal sintered layer, and in the base film, a number of voids having a maximum width of 5 μm or more in plan view is 10 or less per a reference unit area of 0.25 mmon a surface of the base film.


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Hidani, Takuto. (2026). Base material for printed circuit, printed circuit, and method of manufacturing base material for printed circuit (U.S. Patent No. 12611845). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12611845

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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