The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2026

Filed:

Nov. 05, 2023
Applicant:

Alloy Enterprises, Inc., Burlington, MA (US);

Inventors:

Nicholas Mykulowycz, Boxford, MA (US);

Alison Forsyth, Somerville, MA (US);

Jason Kovacs, Somerville, MA (US);

Lyle Cheatham, Marblehead, MA (US);

Assignee:

Alloy Enterprises Inc., Burlington, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/147 (2017.01); B23K 1/20 (2006.01); B23K 20/02 (2006.01); B23K 20/10 (2006.01); B29C 64/223 (2017.01); B29K 105/00 (2006.01); B32B 15/01 (2006.01); B32B 15/20 (2006.01); B32B 37/06 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 70/00 (2020.01);
U.S. Cl.
CPC ...
B29C 64/147 (2017.08); B29C 64/223 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 70/00 (2014.12); B23K 1/20 (2013.01); B23K 20/021 (2013.01); B23K 20/023 (2013.01); B23K 20/10 (2013.01); B23P 2700/12 (2013.01); B29K 2105/256 (2013.01); B32B 15/01 (2013.01); B32B 15/20 (2013.01); B32B 37/06 (2013.01);
Abstract

A method for the additive manufacturing of an object and a system for manufacturing an object. The method includes depositing a second foil sheet onto the first foil sheet, wherein the first foil sheet and the second foil sheet each comprise a structural layer, forming a layer stack comprising the first foil sheet and the second foil sheet, the layer stack comprising an object section and at least one support section configured to enclose the object section in the layer stack, and applying at least one of heat or pressure to opposite sides of the layer stack with a first plate and a second plate, wherein applying the at least one of heat or pressure increases the temperature of the layer stack to a temperature lower than the melting temperature of the structural layer, and the at least one of heat or pressure bonds the first foil sheet to the second foil sheet in the layer stack, the first plate and the second plate are in contact with the at least one support section, and the at least one support section is configured to conduct the at least one of heat or pressure through the layer stack to the object section.


Find Patent Forward Citations

Loading…