The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2026

Filed:

Nov. 19, 2022
Applicant:

Sumitomo Heavy Industries, Ltd., Tokyo, JP;

Inventors:

Yutaka Tsutsumi, Chiba, JP;

Daigo Hotta, Chiba, JP;

Shun Shibuya, Chiba, JP;

Yuki Matsui, Chiba, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/76 (2006.01); B29C 37/00 (2006.01); B29C 45/00 (2006.01);
U.S. Cl.
CPC ...
B29C 45/7653 (2013.01); B29C 2037/906 (2013.01); B29C 45/0025 (2013.01); B29C 2945/76505 (2013.01); B29C 2945/76869 (2013.01);
Abstract

A technique for suppressing molding defects is provided. A control device of an injection molding machine includes: a mold clamping control unit that controls, with respect to an actual value of a mold clamping force for pressing a stationary mold and a movable mold after pressurizing of the mold clamping force is completed and before a molding material reaches parting surfaces of the stationary mold and the movable mold, a range of increase in the actual value of the mold clamping force after the molding material reaches the parting surfaces to an upper limit or less.


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