The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2026
Filed:
Feb. 05, 2019
Applicant:
Daikin Industries, Ltd., Osaka, JP;
Inventors:
Masayuki Tsuji, Osaka, JP;
Taku Yamanaka, Osaka, JP;
Assignee:
DAIKIN INDUSTRIES, LTD., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 6/10 (2006.01); A61L 9/18 (2006.01); C08F 6/00 (2006.01); C08F 6/16 (2006.01); C08F 6/28 (2006.01); C08J 3/28 (2006.01); B08B 7/00 (2006.01); C08F 114/26 (2006.01);
U.S. Cl.
CPC ...
A61L 9/18 (2013.01); C08F 6/00 (2013.01); C08F 6/10 (2013.01); C08F 6/16 (2013.01); C08F 6/28 (2013.01); C08J 3/28 (2013.01); B08B 7/0035 (2013.01); C08F 114/26 (2013.01);
Abstract
The disclosure provides a method for removing a C4-C20 hydrophilic compound. The method for removing a hydrophilic compound includes step (a) of exposing a composition containing a C4-C20 hydrophilic compound to 0.1 to 500 kGy of radiation to remove the hydrophilic compound.