The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2026
Filed:
Jul. 13, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Yeunhee Huh, Namyangju-si, KR;
Chisung Bae, Yongin-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
An integrated circuit having a plurality of stacked chips, and a method of manufacturing thereof are provided. The integrated circuit includes a substrate, a plurality of chips stacked on a printed circuit board, wherein each of the plurality of chips includes a plurality of circuits, and a plurality of interconnects configured to electrically connect each of the plurality of circuits included in the each of the plurality of chips to the substrate, wherein the plurality of chips are unconnected with regard to each other, and are stacked such that areas of each of the plurality of chips, to which the plurality of interconnects are connected, are disposed in a non-overlapping manner with each other.