The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2026
Filed:
Feb. 25, 2022
Applicant:
Kioxia Corporation, Tokyo, JP;
Inventors:
Soichi Homma, Mie, JP;
Kazuma Hasegawa, Kanagawa, JP;
Assignee:
KIOXIA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2023.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06586 (2013.01);
Abstract
A semiconductor device includes: an interconnect substrate including a plurality of interconnect layers; a first semiconductor chip disposed over the interconnect substrate; a second semiconductor chip disposed over the first semiconductor chip in a shifted manner and including a plurality of metal bumps on a surface of the second semiconductor chip facing the interconnect substrate; and a plurality of columnar electrodes connecting the interconnect structure to the metal bumps.