The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2026
Filed:
Dec. 12, 2022
Huawei Technologies Co., Ltd., Guangdong, CN;
HUAWEI TECHNOLOGIES CO., LTD., Shenzhen, CN;
Abstract
The technology of this application relates to a switching power module that includes a substrate, a die embedded in the substrate, and a packaging layer. The packaging layer covers an integrated circuit layout layer of the die. The packaging layer packages the integrated circuit layout layer of the die, the die includes a composite material layer covering the integrated circuit layout layer, and the composite material layer includes at least two material layers that have different functions. The at least two material layers include a first material layer covering the integrated circuit layout layer, the first material layer is a mixed layer of undoped silicate glass and tetraethyl orthosilicate, and the first material layer is filled in a gap between metal protrusions of the integrated circuit layout layer, thereby improving an isolation effect between the metal protrusions. The mixed layer of the undoped silicate glass and the tetraethyl orthosilicate has a good thermal stress effect.