The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2026
Filed:
Jun. 08, 2023
Applicant:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Inventor:
Naganori Hirakawa, Nagaokakyo, JP;
Assignee:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 74/10 (2026.01); H10W 70/09 (2026.01); H10W 74/01 (2026.01); H10W 74/47 (2026.01); H10W 74/40 (2026.01);
U.S. Cl.
CPC ...
H10W 74/114 (2026.01); H10W 70/09 (2026.01); H10W 74/01 (2026.01); H10W 74/47 (2026.01); H10W 74/40 (2026.01);
Abstract
An electronic component includes a plurality of laminated insulating layers, one or more surface conductors formed on a surface of the insulating layer, and an internal conductor formed at a boundary portion between the adjacent insulating layers. A thickness of the surface conductor is larger than a thickness of a thinnest layer of the insulating layers and larger than a thickness of the internal conductor.
Quick Actions:
Hirakawa, Naganori. (2026). Electronic component and method for forming resin layer on electronic component (U.S. Patent No. 12610848). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12610848
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile