The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2026

Filed:

Mar. 27, 2024
Applicant:

Protec Co., Ltd., Gyeonggi-do, KR;

Inventors:

Youn Sung Ko, Gyeonggi-do, KR;

Geunsik Ahn, Seoul, KR;

Assignee:

PROTEC CO., LTD., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 72/00 (2026.01); H05K 3/34 (2026.01);
U.S. Cl.
CPC ...
H10W 72/012 (2026.01); H10W 72/01212 (2026.01); H10W 72/01225 (2026.01); H10W 72/01257 (2026.01);
Abstract

The present disclosure relates to a method of bonding column type deposits to a substrate, and more specifically, to a method of bonding to a substrate column type deposits, which are formed in a column shape and connect the substrate and electrodes of a semiconductor chip so as to connect the semiconductor chip to the substrate. A method of bonding column type deposits to a substrate according to the present disclosure has the advantage of bonding the column type deposits having a high aspect ratio to accurate positions while being aligned vertically on the substrate.


Find Patent Forward Citations

Ko, Youn. (2026). Method of bonding column type deposits (U.S. Patent No. 12610841). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12610841

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…