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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12610836 B1

PDFFull Text
Date of Patent:
Apr. 21, 2026

Filed:

Sep. 07, 2022

Semiconductor device

Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Yusuke Harada, Kyoto, JP;

Hiroyuki Shinkai, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:

HSML P.C.

Primary Examiner:

Jeff W Natalini

Assistant Examiner:

Rose undefined Keagy

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/3121 (2013.01); H01L 23/36 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13164 (2013.01);
Abstract

A semiconductor device includes an electrically insulating substrate including a substrate main surface and a substrate back surface facing opposite to each other in a thickness direction and at least one substrate side surface facing a direction intersecting the thickness direction, a semiconductor element arranged at a side of the substrate main surface, a heat-dissipating conductive portion that is provided at a position overlapping with at least a portion of the semiconductor element when viewed from the thickness direction and is exposed from the substrate back surface, a sealing resin that seals the semiconductor element while covering the substrate main surface, and at least one wiring portion that is connected to the heat-dissipating conductive portion, extends from the heat-dissipating conductive portion to the substrate side surface while being exposed from the substrate back surface, and is exposed from the substrate side surface.

Find Patent Forward Citations

Harada, Yusuke. (2026). Semiconductor device (U.S. Patent No. 12610836). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12610836

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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