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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12610830 B1

PDFFull Text
Date of Patent:
Apr. 21, 2026

Filed:

Sep. 13, 2023

Semiconductor device and method for manufacturing semiconductor device

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Taketo Nishiyama, Tokyo, JP;

Kenji Saito, Tokyo, JP;

Assignee:

Mitsubishi Electric Corporation, Tokyo, JP;

Attorney:

Studebaker Brackett PLLC

Primary Examiner:

Lauren R Bell

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 23/053 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49551 (2013.01); H01L 21/56 (2013.01); H01L 23/053 (2013.01); H01L 23/3121 (2013.01); H01L 23/49811 (2013.01); H01L 23/49861 (2013.01); H01L 24/32 (2013.01); H01L 2224/32225 (2013.01);
Abstract

A lead frame connects a metal wiring and an electrode of a case. A seal material is filled in the case. The lead frame includes a first joint portion joined to the metal wiring, a second joint portion joined to the electrode, and a connection portion connecting the first joint portion and the second joint portion. The connection portion includes an inclined portion inclined with respect to the upper surface of the insulating substrate on a cross-section across an extension direction of the lead frame, a first non-inclined portion provided between the inclined portion and the first joint portion, and a second non-inclined portion provided between the inclined portion and the second joint portion. Slits are provided on both sides of the lead frame at a boundary of the first non-inclined portion and the inclined portion and a boundary of the second non-inclined portion and the inclined portion.

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Nishiyama, Taketo. (2026). Semiconductor device and method for manufacturing semiconductor device (U.S. Patent No. 12610830). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12610830

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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