The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2026

Filed:

Nov. 28, 2022
Applicant:

Tencent Technology (Shenzhen) Company Limited, Shenzhen, CN;

Inventors:

Dengfeng Li, Shenzhen, CN;

Wenlong Zhang, Shenzhen, CN;

Kunliang Bu, Shenzhen, CN;

Maochun Dai, Shenzhen, CN;

Yarui Zheng, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); C23C 14/54 (2006.01); H10N 60/01 (2023.01);
U.S. Cl.
CPC ...
H01L 21/76898 (2013.01); C23C 14/54 (2013.01); H10N 60/01 (2023.02);
Abstract

This application discloses a coating method for making a chip. The method includes: fixing a substrate on a base. The substrate includes a hole. The method includes controlling an included angle between a plane on which the substrate is located and a deposition direction of a coating material to be greater than 0 degrees and less than 90 degrees. The method includes controlling the substrate to rotate with respect to an axis perpendicular to the plane on which the substrate is located. The method includes during the rotation of the substrate, controlling the coating material to enter the hole along the deposition direction such that the coating material is deposited on a sidewall of the hole.


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