The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2026

Filed:

Sep. 05, 2022
Applicant:

Center for Advanced Meta-materials, Daejeon, KR;

Inventors:

Se Jeong Won, Daejeon, KR;

Hak Joo Lee, Daejeon, KR;

Jung Yup Kim, Daejeon, KR;

Jae Hyun Kim, Daejeon, KR;

Yun Hwangbo, Daejeon, KR;

Sang Min Kim, Daejeon, KR;

Sung UK Yoon, Daejeon, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B29C 33/38 (2006.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
H01L 21/67092 (2013.01); B29C 33/3842 (2013.01); B33Y 80/00 (2014.12);
Abstract

Disclosed herein are a non-rigid pad for device transfer, which allows uniform contact pressure to be applied between multiple devices and a target substrate to which the devices are to be transferred, a method of manufacturing the same, and a non-rigid pad group for device transfer including the same. The non-rigid pad includes: a base plate; and multiple pillars each protruding from one surface of the base plate with one end thereof connected to the one surface of the base plate, the pillars being bent and deformed upon application of external force, wherein the non-rigid pad is disposed between a transfer film to which multiple devices to be transferred to a target substrate are adhesively attached and a pressing unit providing pressing force to transfer the multiple devices to the target substrate, the non-rigid pad being bent and deformed upon application of pressing force by the pressing unit to allow uniform contact pressure to be applied between the multiple devices and the target substrate.


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