The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2026
Filed:
Mar. 18, 2024
Samsung Electronics Co., Ltd., Suwon-si, KR;
Junsang Kim, Suwon-si, KR;
Yunha Kim, Suwon-si, KR;
Hyeonjun Yun, Suwon-si, KR;
Kwanghyun Cho, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A method of processing a substrate includes disposing a substrate in a substrate processing apparatus and polishing the substrate. The substrate processing apparatus includes a polishing head and a polishing part. The polishing head includes a polishing head body. The polishing head body includes a pressure member including a first zone and a second zone. The substrate includes a first substrate zone located under the first zone and a second substrate zone located under the second zone. The polishing of the substrate includes rotating the substrate while applying a (1,1)-th pressure to the first substrate zone and applying a (2,1)-th pressure to the second substrate zone, calculating a (1,1)-th polishing rate of the first substrate zone and a (2,1)-th polishing rate of the second substrate zone, determining a reference polishing rate, and resetting a pressure applied to the first substrate zone to a (1,2)-th pressure.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile