The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2026
Filed:
Apr. 21, 2022
Boe Technology Group Co., Ltd., Beijing, CN;
Nianqi Yao, Beijing, CN;
Zhongpeng Tian, Beijing, CN;
Ce Ning, Beijing, CN;
Zhengliang Li, Beijing, CN;
Hehe Hu, Beijing, CN;
Jie Huang, Beijing, CN;
Jiayu He, Beijing, CN;
Feifei Li, Beijing, CN;
Kun Zhao, Beijing, CN;
Yimin Chen, Beijing, CN;
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
Abstract
A circuit board includes a substrate and a stress neutral layer disposed on a side of the substrate. The stress neutral layer includes one or more first metal layers and one or more second metal layers. The one or more second metal layers and the one or more first metal layers are stacked. At least one of the one or more first metal layers is made of a material for generating a tensile stress, and at least one of the one or more second metal layers is made of a material for generating a compressive stress.