The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2026
Filed:
Sep. 02, 2022
Kabushiki Kaisha Toshiba, Tokyo, JP;
Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;
Kazuki Minamikawa, Nomi Ishikawa, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Toshiba Electronic Devices & Storage Corporation, Kawasaki, JP;
Abstract
A semiconductor chip includes a semiconductor substrate, a plurality of first wirings extending in a first direction parallel to the upper surface of the semiconductor substrate and disposed entirely above the upper surface of the semiconductor substrate, a second wiring disposed between two of the first wirings that are adjacent to each other and entirely below the upper surface of the semiconductor substrate such that an upper surface of the second wiring is below a lower surface of the two first wirings, and a first insulating film provided on the second wiring and spaced apart from the two first wirings in a second direction that is perpendicular to the first direction, the first insulating film having an upper surface that is above the lower surface of the two first wirings.