The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2026

Filed:

Oct. 14, 2022
Applicant:

Fast Sic Semiconductor Incorporated, Hsinchu City, TW;

Inventors:

Fu-Jen Hsu, Hsinchu City, TW;

Cheng-Tyng Yen, Hsinchu City, TW;

Hsiang-Ting Hung, Hsinchu City, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 8/60 (2025.01); H10D 62/60 (2025.01); H10D 62/832 (2025.01);
U.S. Cl.
CPC ...
H10D 8/60 (2025.01); H10D 62/60 (2025.01); H10D 62/8325 (2025.01);
Abstract

A silicon carbide semiconductor device comprises a SiC substrate, a drift layer disposed on the substrate, a plurality of first doping regions formed near a surface of the drift layer, a plurality of second doping regions formed near the surface of the drift layer and between the first doping regions and a first metal layer disposed on the surface of the drift layer. The first metal layer forms an Ohmic contact with the second doped region. The drift layer has a first doping concentration of a first conductivity type and each of the second doping regions has a second doping concentration of the first conductivity type, which is higher than the first doping concentration. Each of the first doping regions has a first depth and each of the second doping regions has a second depth which is smaller than the first depth.


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