The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2026

Filed:

Nov. 29, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Euichul Jeong, Yongin-si, KR;

Kiseok Lee, Hwaseong-si, KR;

Wonki Roh, Yongin-si, KR;

Hyungeun Choi, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 63/00 (2023.01); H10B 12/00 (2023.01);
U.S. Cl.
CPC ...
H10B 12/30 (2023.02); H10B 12/03 (2023.02); H10B 12/05 (2023.02); H10B 12/482 (2023.02);
Abstract

A semiconductor memory device including a transistor body extending in a first horizontal direction and including a first source/drain region, a single-crystal channel layer, and a second source/drain region sequentially arranged in the first horizontal direction, a gate electrode layer extending in a second horizontal direction orthogonal to the first horizontal direction and covering upper and lower surfaces of the single-crystal channel layer, a bit line connected to the first source/drain region, extending in a vertical direction, and having a first width in the second horizontal direction, a spacer covering upper and lower surfaces of the first source/drain region and having a second width greater than the first width, and a cell capacitor on a side opposite to the bit line with respect to the transistor body in the first horizontal direction and including lower and upper electrode layers and a capacitor dielectric layer therebetween may be provided.


Find Patent Forward Citations

Loading…