logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12610472 B1

PDFFull Text
Date of Patent:
Apr. 21, 2026

Filed:

Jan. 30, 2024

Integrated circuit (ic) assembly including a direct connection pad structure for a surface-mount device (smd)

Applicant:

Dell Products L.p., Round Rock, TX (US);

Inventors:

Bhyrav M. Mutnury, Round Rock, TX (US);

Sandor Tibor Farkas, Round Rock, TX (US);

James Lewis Petivan, Austin, TX (US);

Assignee:

Dell Products L.P., Round Rock, TX (US);

Attorney:

McDermott Will & Schulte LLP

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H05K 3/34 (2026.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2023.01); H05K 1/02 (2006.01); H05K 3/341 (2026.01); H05K 3/3485 (2026.01); H05K 3/36 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3485 (2020.08); H01L 21/486 (2013.01); H01L 23/3128 (2013.01); H01L 25/0657 (2013.01); H05K 1/0298 (2013.01); H05K 3/341 (2013.01); H05K 3/3436 (2013.01); H05K 3/3457 (2013.01); H05K 3/363 (2013.01); H05K 3/429 (2013.01); H01L 2924/1517 (2013.01); H01L 2924/15311 (2013.01); H05K 2201/10734 (2013.01); H05K 2203/041 (2013.01);
Abstract

An IC assembly, including a PCB, including a first stripline; a ground layer; a first cavity extending from the PCB to the first stripline; a second cavity extending from the PCB to the ground layer; wherein the first cavity includes first solder paste in contact with the first portion of the first stripline exposed at the first cavity, wherein the second cavity includes second solder paste in contact with the second portion of the ground layer exposed at the second cavity, a BGA including a first solder ball and a second solder ball; wherein the BGA is coupled to the PCB, including: the first solder ball positioned within the first cavity such that the first solder ball contacts the first solder paste in the first cavity; the second solder ball positioned with the second cavity such that the second solder ball contacts the second solder paste in the second cavity.

Find Patent Forward Citations

Mutnury, Bhyrav. (2026). Integrated circuit (ic) assembly including a direct connection pad structure for a surface-mount device (smd) (U.S. Patent No. 12610472). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12610472

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…