The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2026
Filed:
Jul. 30, 2021
Tokuyama Corporation, Shunan, JP;
TOKUYAMA CORPORATION, Shunan, JP;
Abstract
The laminate for a circuit board of the present invention is a laminate including a metal nitride sintered board and a copper sheet, and the laminate has a size with a minimum length from a center of a plane to a peripheral edge of 50 mm or more, and has a void ratio X of 0.50% or less, which is a ratio of a total length Lof voids having a diameter of 1 μm or more confirmed in the vicinity of a bonding interface of the metal nitride sintered board and the copper sheet with respect to a measured length Lof the bonding interface, measured on a cut cross section obtained by cutting the laminate in a lamination direction. According to the present invention, a laminate that is excellent in heat radiation capability, has a feature that an etching solution used in patterning is difficult to remain at the bonding interface, and is excellent in reliability as a product can be provided.