The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2026
Filed:
Oct. 22, 2021
Chengdu Boe Optoelectronics Technology Co., Ltd., Chengdu, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Yonglin Chen, Beijing, CN;
Yunhan Xiao, Beijing, CN;
Hongjin Hu, Beijing, CN;
Jiaxiang Zhang, Beijing, CN;
Kun Zuo, Beijing, CN;
Mingqiang Wang, Beijing, CN;
Jiuyuan Bai, Beijing, CN;
Chengdu BOE Optoelectronics Technology Co., Ltd., Chengdu, CN;
BOE Technology Group Co., Ltd., Beijing, CN;
Abstract
Provided is a flexible circuit board. The flexible circuit board includes a circuit substrate; wherein the circuit substrate is a multilayer flexible circuit board, wherein at least two layers of the multilayer flexible circuit board include plated sublayers, and a plurality of grooves are disposed in a first surface of the multilayer flexible circuit board, a depth of the groove being not less than a depth of the plated sublayer closest to the first surface in the multilayer flexible circuit board.