The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2026

Filed:

Jul. 19, 2023
Applicant:

Delta Electronics (Shanghai) Co., Ltd, Shanghai, CN;

Inventors:

Hui Li, Shanghai, CN;

Le Liang, Shanghai, CN;

Wulong Cong, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/26 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 1/181 (2026.01); H05K 3/24 (2006.01); H05K 7/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0231 (2013.01); G06F 1/26 (2013.01); H05K 1/115 (2013.01); H05K 1/144 (2013.01); H05K 1/145 (2013.01); H05K 1/181 (2013.01); H05K 3/243 (2013.01); H05K 7/023 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10734 (2013.01);
Abstract

A vertical power supply system and a manufacturing method of a connection board are provided. The vertical power supply system includes a system board, a substrate, a chip unit, a plurality of first capacitors, a plurality of second capacitors, a plurality of conductive portions and a power unit. The system board includes a first surface and a second surface which are opposite to each other. The substrate includes a third surface and a fourth surface which are opposite to each other, and the third surface is located between the fourth surface and the second surface. The chip unit is disposed on the first surface. The first capacitors are disposed on the second surface. The second capacitors are disposed on the third surface. The third surface and the second surface are electrically connected through the conductive portions. The power unit is disposed on the fourth surface.


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