The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2026
Filed:
Nov. 29, 2023
Microsoft Technology Licensing, Llc, Redmond, WA (US);
Shubhangi Tewari, Redmond, WA (US);
Bharath Ramakrishnan, Bellevue, WA (US);
Microsoft Technology Licensing, LLC, Redmond, WA (US);
Abstract
Printed circuit boards (PCBs) are a fundamental component used in nearly all electronics. PCBs provide electrical connections and mechanical support to electronic components and are generally made of copper layers laminated onto, through, and/or between one or more non-conductive substrate layers. The presently disclosed technology is directed to microfluidic cooling systems for PCBs. Such systems may be used to alleviate thermal issues caused by continuous operation of high-power components on PCB boards with high-current density signals and fast switching power supplies, for example, all of which generate substantial quantities of thermal energy to dissipate. A microfluidic pump is connected in line with the network of microfluidic passages. The microfluidic pump flows a coolant fluid through the network of microfluidic passages to cool heat-generating components on the PCB.