The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2026

Filed:

Feb. 06, 2023
Applicant:

Soundskrit Inc., Montreal, CA;

Inventors:

Stephane Leahy, Montreal, CA;

Wan-Thai Hsu, Saline, MI (US);

Sahil Gupta, Montreal, CA;

Assignee:

Soundskrit Inc., Montreal, CA;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04R 1/28 (2006.01); H04R 1/04 (2006.01); H04R 3/00 (2006.01); H04R 19/00 (2006.01); H04R 19/04 (2006.01);
U.S. Cl.
CPC ...
H04R 1/2846 (2013.01); H04R 1/04 (2013.01); H04R 3/00 (2013.01); H04R 19/005 (2013.01); H04R 19/04 (2013.01); H04R 2201/003 (2013.01);
Abstract

An acoustic sensor device comprises a package and a substrate disposed in the package. The acoustic sensor device also comprises a microelectromechanical system (MEMS) transducer formed in the substrate, the MEMS transducer i) comprising a cantilever structure and ii) having a first acoustic impedance and at least two sound ports positioned on the package on opposing sides of the MEMS transducer. The at least two sound ports coupling the MEMS transducer to an ambient environment via respective acoustic channels formed in the package, wherein the at least two sound ports are positioned on the package in a manner that ensures that the respective acoustic channels have a combined second acoustic impendence that is less the first acoustic impedance of the MEMS transducer.


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