The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2026

Filed:

Jan. 17, 2024
Applicants:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Postech Research and Business Development Foundation, Pohang-si, KR;

Inventors:

Seungtae Ko, Suwon-si, KR;

Youngju Lee, Suwon-si, KR;

Jaehong Choi, Pohang-si, KR;

Wonbin Hong, Pohang-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 5/02 (2006.01); H01P 1/18 (2006.01); H01Q 1/32 (2006.01); H01Q 3/46 (2006.01); H01Q 15/00 (2006.01); H10D 86/80 (2025.01);
U.S. Cl.
CPC ...
H01P 5/02 (2013.01); H01P 1/18 (2013.01); H01Q 1/3291 (2013.01); H01Q 3/46 (2013.01); H01Q 15/002 (2013.01); H10D 86/80 (2025.01);
Abstract

An electronic device includes: a glass substrate including a first surface and a second surface opposite to the first surface; a semiconductor element provided on the first surface of the glass substrate; a first pattern provided on the first surface of the glass substrate, the first pattern being electrically connected to a first end of the semiconductor element; a second pattern provided on the first surface of the glass substrate, the second pattern being electrically connected to a second end of the semiconductor element; a feeding line provided on the second surface of the glass substrate; and a via hole which passes through the glass substrate in a first direction, the via hole electrically connecting the feeding line to the second pattern.


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