The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2026
Filed:
Jul. 18, 2022
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Hokuto Eda, Tokyo, JP;
Hitoshi Ohkubo, Tokyo, JP;
Masazumi Arata, Tokyo, JP;
Masataro Saito, Tokyo, JP;
Kohei Takahashi, Tokyo, JP;
Takamasa Iwasaki, Tokyo, JP;
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 27/32 (2006.01); H01F 27/29 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2847 (2013.01); H01F 27/2876 (2013.01); H01F 27/324 (2013.01); H01F 27/29 (2013.01); H01F 27/327 (2013.01);
Abstract
In a coil component, heat radiation around a through conductor is improved. In the coil component, since the cross-sectional area of the inner end portion of the planar coil is designed to be relatively large, heat generated in the through conductor is easily transferred to the inner end portion. Since heat is efficiently transferred from the through conductor to the inner end portion, high heat radiation around the through conductor is achieved.