The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2026

Filed:

Aug. 21, 2024
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Nozomu Hayashi, Tochigi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F 9/00 (2006.01); G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
G03F 9/7042 (2013.01); G03F 7/0002 (2013.01); G03F 9/7088 (2013.01); G03F 9/7092 (2013.01);
Abstract

A position measuring method includes an image capturing element for capturing an image of an alignment mark. The method includes first processing of setting processing areas on the image capturing element for capturing an image of the alignment mark and performing position measurement processing, and second processing of calculating a position of the alignment mark on the basis of the processing areas set in the first processing. The position of the alignment mark is calculated using a plurality of the processing areas set by shifting the processing areas from each other in units of one pixel of the image capturing element.


Find Patent Forward Citations

Hayashi, Nozomu. (2026). Position measuring method, method for manufacturing article, position measuring apparatus, semiconductor manufacturing apparatus, and imprint apparatus (U.S. Patent No. 12607945). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12607945

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…