The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2026

Filed:

Jun. 14, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Deukseok Chung, Yongin-si, KR;

Shin Ae Jun, Seongnam-si, KR;

Tae Gon Kim, Hwaseong-si, KR;

Shang Hyeun Park, Yongin-si, KR;

Min Jong Bae, Yongin-si, KR;

A Ra Jo, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 5/20 (2006.01); B82Y 20/00 (2011.01); B82Y 30/00 (2011.01); C09K 11/06 (2006.01); G02B 1/04 (2006.01); H10K 50/115 (2023.01); H10K 50/844 (2023.01); H10K 59/38 (2023.01); H10K 71/00 (2023.01);
U.S. Cl.
CPC ...
G02B 5/206 (2013.01); C09K 11/06 (2013.01); G02B 1/04 (2013.01); H10K 50/115 (2023.02); H10K 50/844 (2023.02); H10K 59/38 (2023.02); H10K 71/00 (2023.02); B82Y 20/00 (2013.01); B82Y 30/00 (2013.01); G02B 2207/101 (2013.01);
Abstract

A display panel, a method of manufacturing the same, and an electronic device including the display panel. The display panel includes a light emitting device array including a plurality of light emitting devices, a color conversion layer disposed on the light emitting device array and converting the emission spectrum of light emitted from the light emitting device array, and an encapsulation film on the color conversion layer, wherein the color conversion layer includes a quantum dot-polymer pattern including a quantum dot-polymer composite, an average roughness (R) of an upper surface of the quantum dot-polymer pattern is less than or equal to about 3% of a thickness of the encapsulation film.


Find Patent Forward Citations

Loading…