The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2026

Filed:

May. 08, 2024
Applicant:

Mico Ceramics Ltd., Anseong-si, KR;

Inventors:

Min-Ho Ji, Anseong-si, KR;

Gi-Myeong Sung, Anseong-si, KR;

Assignee:

MiCo Ceramics Ltd., Anseong-si, KR;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/52 (2006.01); B29C 65/00 (2006.01); B29L 31/34 (2006.01); B32B 3/26 (2006.01); B32B 3/30 (2006.01); B32B 7/12 (2006.01); C23C 14/50 (2006.01); C23C 16/458 (2006.01); H01J 37/32 (2006.01); H10P 72/00 (2026.01); H10P 72/72 (2026.01); H10P 72/76 (2026.01);
U.S. Cl.
CPC ...
C23C 16/4586 (2013.01); B29C 65/002 (2013.01); B29C 65/52 (2013.01); B29C 66/004 (2013.01); B29C 66/45 (2013.01); B32B 3/266 (2013.01); B32B 3/30 (2013.01); B32B 7/12 (2013.01); C23C 14/50 (2013.01); H01J 37/32715 (2013.01); H01J 37/32724 (2013.01); H10P 72/0434 (2026.01); H10P 72/722 (2026.01); H10P 72/7624 (2026.01); B29L 2031/34 (2013.01); B32B 2457/00 (2013.01); H01J 2237/2001 (2013.01); H01J 2237/2007 (2013.01);
Abstract

The present disclosure relates to a method of manufacturing a susceptor. The present disclosure may provide a method of manufacturing a susceptor in which a cap-type bushing structure or tube structure is applied to a bonding structure of a base substrate and an insulating plate, so that the bonding structure can withstand or prevent the increase in pressure inside a gas flow path during a curing process, thereby preventing clogging of a gas hole in a high-power susceptor or the like for a high aspect ratio contact (HARC) processes, and minimizing the occurrence of arcing by reducing contamination around the gas hole. In addition, the present disclosure may also provide a susceptor manufactured by the method.


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