The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2026
Filed:
Feb. 19, 2021
Applicant:
Nitto Denko Corporation, Osaka, JP;
Inventors:
Mizuho Mizuno, Osaka, JP;
Akiko Tanaka, Osaka, JP;
Naofumi Kosaka, Osaka, JP;
Kozo Nakamura, Osaka, JP;
Assignee:
NITTO DENKO CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 133/08 (2006.01); C09J 133/12 (2006.01);
U.S. Cl.
CPC ...
C09J 133/12 (2013.01); C09J 133/08 (2013.01); C09J 2301/312 (2020.08); C09J 2301/414 (2020.08); Y10T 428/2891 (2015.01);
Abstract
An adhesive layer () has a creep deformation rate when a stress of 10000 Pa is applied at 50° C. for 1 second is 10% or less, and a creep deformation rate when a stress of 10000 Pa is applied at 50° C. for 30 minutes is 16% or less, in a creep test using a rotational rheometer, and has a 180° peel adhesive strength of 10 mN/20 mm or more with respect to a PMMA film.