The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2026

Filed:

Aug. 30, 2023
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Junbeom Shin, Hwaseong-Si, KR;

Jeongwan Choi, Suwon-Si, KR;

Jong-Pil Kim, Gyeonggi-do, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 9/02 (2006.01); C09J 5/00 (2006.01); C09J 7/21 (2018.01); H01B 5/00 (2006.01); H05K 3/20 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); C09J 5/00 (2013.01); C09J 7/21 (2018.01); H01B 5/00 (2013.01); H05K 3/20 (2013.01); C09J 2203/326 (2013.01); C09J 2301/1242 (2020.08); C09J 2301/408 (2020.08); C09J 2400/166 (2013.01);
Abstract

An electrically conductive bonding tape includes a conductive first film between, and bonded to, conductive first and second adhesive layers. The first film and the first and second adhesive layers are conductive at least along a thickness direction of the bonding tape. Each of the first and second adhesive layers includes conductive particles dispersed substantially as a single layer in a substantially insulative adhesive material. The plurality of conductive particles in each of the first and second adhesive layers has an average particle size Pand a standard of deviation P, such that P/Pis less than about 0.2. Each of the first and second adhesive layers has an average thickness of no more than about 15% greater than the average particle size of the particles in the adhesive layer. An average surface roughness of opposing major first and second surfaces of the first film is less than 10 microns.


Find Patent Forward Citations

Shin, Junbeom. (2026). Electrically conductive tape with monolayered conductive pressure sensitive adhesive (U.S. Patent No. 12606724). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12606724

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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