The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2026
Filed:
Jul. 26, 2023
Canon Kabushiki Kaisha, Tokyo, JP;
Tetsushi Ishikawa, Tokyo, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
Provided is a method for manufacturing a substrate bonded body in which a first substrate and a second substrate are bonded together, the first substrate forming a first portion of an element, and the second substrate forming a second portion of the element, including: a film-forming step of forming an inorganic film on a bonding face of the first substrate, the bonding face facing the second substrate, such that the bonding face has a convex shape toward the second substrate; a contact step of bringing the first substrate and the second substrate closer and into contact with each other; and a bonding step of bonding the first substrate and the second substrate by an adhesive.