The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2026
Filed:
May. 25, 2023
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Yohei Sato, Tokyo, JP;
Hiroshi Koizumi, Tokyo, JP;
Toshinobu Miyagoshi, Tokyo, JP;
Osamu Shindo, Tokyo, JP;
Seijiro Sunaga, Tokyo, JP;
Mitsuyoshi Makida, Tokyo, JP;
Makoto Yamashita, Tokyo, JP;
Yasuo Kato, Tokyo, JP;
Ryo Shindo, Tokyo, JP;
Masashi Matsumoto, Tokyo, JP;
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B25B 11/00 (2006.01); B30B 12/00 (2006.01); B30B 15/04 (2006.01); B30B 15/06 (2006.01);
U.S. Cl.
CPC ...
B30B 12/00 (2013.01); B25B 11/00 (2013.01); B30B 15/04 (2013.01); B30B 15/062 (2013.01);
Abstract
A substrate processing apparatusapplies pressure to a substratewhich is an object to be pressurized arranged on an upper jig plate. The substrate processing apparatusincludes a lower jig platearranged below the upper jig plate, an installation baseprovided on the lower jig plateand the substrateis arranged; and the installation base is temporarily fixed to the installation basein a deformable manner.