The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2026

Filed:

Mar. 03, 2023
Applicant:

Senju Metal Industry Co., Ltd., Tokyo, JP;

Inventors:

Mutsuki Kaneko, Tokyo, JP;

Ryuichi Tsuda, Tokyo, JP;

Kazuyori Takagi, Tokyo, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/362 (2006.01); B23K 35/02 (2006.01); B23K 35/36 (2006.01);
U.S. Cl.
CPC ...
B23K 35/362 (2013.01); B23K 35/025 (2013.01); B23K 35/3613 (2013.01);
Abstract

The present invention employs a flux containing a resin component, an activator, and a solvent. The resin component contains a copolymer (A) having an alkene-derived repeating unit (a1), and an acrylic acid-derived repeating unit (a2) in which a hydrogen atom bonded to a carbon atom at an α-position may be substituted with a substituent, and contains a rosin (B). A mixing ratio of the copolymer (A) and the rosin (B) is 1 or more as a mass ratio represented by copolymer (A)/rosin (B).


Find Patent Forward Citations

Kaneko, Mutsuki. (2026). Flux and solder paste (U.S. Patent No. 12605794). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12605794

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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