The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2026
Filed:
May. 25, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Youngja Kim, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A solder reflow system may include a solder reflow apparatus, a condensation apparatus and a cleaning apparatus. The solder reflow apparatus may be configured to reflow a solder of a semiconductor package using a heat transfer fluid. The condensation apparatus may be configured to receive the semiconductor package processed by the solder reflow apparatus. The condensation apparatus may condensate a gas generated from the heat transfer fluid to convert the gas into a liquid. The cleaning apparatus may be configured to clean the semiconductor package processed by the condensation apparatus using a cleaning agent. Thus, the heat transfer fluid stained with the semiconductor package may be removed by the condensation apparatus so that the heat transfer fluid may not be introduced into the cleaning apparatus. As a result, the heat transfer fluid may not be mixed with the cleaning agent to maintain cleaning capacity of the cleaning agent.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile