The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2026
Filed:
Mar. 15, 2021
Applicant:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Inventors:
Susumu Obata, Yokohama, JP;
Mitsuo Sano, Kamakura, JP;
Keiichiro Matsuo, Yokohama, JP;
Kazuhito Higuchi, Yokohama, JP;
Kazuo Shimokawa, Yokohama, JP;
Assignee:
KABUSHIKI KAISHA TOSHIBA, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B01J 37/02 (2006.01); B01J 23/42 (2006.01); B01J 23/44 (2006.01); B01J 23/50 (2006.01); B01J 23/52 (2006.01); B01J 35/31 (2024.01);
U.S. Cl.
CPC ...
B01J 37/0217 (2013.01); B01J 23/42 (2013.01); B01J 23/44 (2013.01); B01J 23/50 (2013.01); B01J 23/52 (2013.01); B01J 35/31 (2024.01); B01J 2235/00 (2024.01);
Abstract
According to an embodiment, a method of forming a catalyst layer includes performing displacement plating on a substrate having a surface that is made of a semiconductor and includes a plurality of projections, thereby depositing a catalytic metal at positions of the plurality of projections.