The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2026

Filed:

Mar. 06, 2020
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Petrus Sundgren, Lappersdorf, DE;

Andreas Biebersdorf, Regensburg, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 90/00 (2026.01); H10H 20/01 (2025.01); H10H 20/824 (2025.01); H10H 20/856 (2025.01); H10H 20/857 (2025.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H10H 20/856 (2025.01); H10H 20/036 (2025.01);
Abstract

The invention relates to a composite component made of a plurality of components, a modified sacrificial layer and a common intermediate carrier, in which the components each have a semiconductor body with an active zone, the semiconductor bodies being arranged on the intermediate carrier and being laterally spaced apart from one another by means of isolating trenches. The sacrificial layer is arranged in the vertical direction between the intermediate carrier and the semiconductor bodies, the sacrificial layer having a plurality of retaining elements between the semiconductor bodies and the common intermediate carrier, and the semiconductor bodies being mechanically connected to the intermediate carrier only by means of the retaining elements. The retaining elements are surrounded by cavities in lateral directions. The semiconductor bodies are designed to be detachable from the intermediate carrier, wherein the retaining elements release the semiconductor bodies from the intermediate carrier under mechanical strain or by means of irradiation or by means of etching. The invention further relates to a component having a semiconductor body which is detached from a composite component of this type, and to a method for producing a plurality of components of this type.


Find Patent Forward Citations

Loading…