The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2026
Filed:
Dec. 16, 2022
Applicant:
Hyundai Mobis Co., Ltd., Seoul, KR;
Inventors:
Se Min Park, Hwaseong-si, KR;
Ji Hye Jeong, Seoul, KR;
Assignee:
Hyundai Mobis Co., Ltd., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/18 (2023.01); H10W 72/00 (2026.01); H10W 72/30 (2026.01); H10W 72/60 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 72/60 (2026.01); H10W 72/30 (2026.01); H10W 72/851 (2026.01); H10W 72/631 (2026.01); H10W 72/634 (2026.01); H10W 72/652 (2026.01); H10W 72/886 (2026.01); H10W 90/00 (2026.01); H10W 90/734 (2026.01); H10W 90/763 (2026.01); H10W 90/764 (2026.01);
Abstract
A metal clip disposed on chips to connect the chips to each other, includes a plurality of bonding parts each having a lower surface configured to bond to an upper surface of each of the chips; and an outer side part formed at each of the bonding parts to extend upward from at least a portion of an outer side of respective ones of the bonding parts to form a step therefrom.
Quick Actions:
Park, Se. (2026). Metal clip applied to power module (U.S. Patent No. 12604753). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12604753
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile