The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2026
Filed:
May. 23, 2023
Japan Display Inc., Tokyo, JP;
Yoshikatsu Imazeki, Tokyo, JP;
Yoichi Kamijo, Tokyo, JP;
JAPAN DISPLAY INC., Tokyo, JP;
Abstract
An electronic device has: a substrate; a wiring formed on the substrate; an inorganic insulating layer covering the wiring; and a bump electrode that is connected to the wiring at a position of overlapping a first opening formed in the inorganic insulating layer and protrudes form the inorganic insulating layer. The wiring is a laminated film of: a first conductor layer made of titanium or a titanium alloy and formed on the substrate; and a second conductor layer made of aluminum or an aluminum alloy and laminated on the first conductor layer. The bump electrode includes: a first conductor portion made of copper or a copper alloy and bonded to the wiring; and a second conductor portion made of solder containing tin and formed on the first conductor portion.