The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2026

Filed:

Sep. 28, 2023
Applicant:

Silicon-magic Semiconductor Technology (Hangzhou) Co., Ltd., Hangzhou City, CN;

Inventor:

Jinyong Cai, Hangzhou City, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/423 (2006.01); H01L 29/66 (2006.01); H10D 30/01 (2025.01); H10D 64/27 (2025.01);
U.S. Cl.
CPC ...
H10D 64/513 (2025.01); H10D 30/021 (2025.01);
Abstract

A method for manufacturing a MOSFET includes: forming a first trench and a second trench; forming a first shield gate dielectric layer and a first shielding conductor at a lower part of the first trench and a second shield gate dielectric layer and a second shielding conductor at a lower part of the second trench; forming a first dielectric interlayer and a second dielectric interlayer; forming a first gate dielectric layer and a first gate conductor at an upper part of the first trench and a second gate dielectric layer and a second gate conductor at an upper part of the second trench; and forming a body region, a source region, and a contact region. A dielectric constant of the second gate dielectric layer located in the second trench is greater than that of the first gate dielectric layer located in the first trench.


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