The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2026
Filed:
Feb. 27, 2020
Audi Ag, Ingolstadt, DE;
Hitachi Energy Ltd, Zürich, CH;
Thomas Gradinger, Aarau Rohr, CH;
David Baumann, Schafisheim, CH;
Chunlei Lui, Oberrohrdorf, CH;
Daniele Torresin, Baden, CH;
AUDI AG, Ingolstadt, DE;
HITACHI ENERGY LTD, Zürich, CH;
Abstract
A converter including a semiconductor module and a cooling housing. The semiconductor module includes a semiconductor chip, a substrate having a first side and a second side, a base plate having a first side and a second side, and a molding compound. The semiconductor chip connects to the first side of the substrate. The second side of the substrate connects to the first side of the base plate, the second side of the base plate has a first region and a second region. The first region has a surface expansion, and the first region having the surface expansion contacts with a coolant liquid in an operating state. The second region forms a closed path around the first region, the cooling housing has a plate including at least one hole, and the plate is connected around the hole to the second region of the base plate by welding.