The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2026
Filed:
Aug. 21, 2023
Applicant:
Rockwell Collins, Inc., Cedar Rapids, IA (US);
Inventors:
Chad A. Siemering, Marion, IA (US);
Martin J. Jennings, Oxford, IA (US);
Levi D. Van Oort, Clarence, IA (US);
Assignee:
Rockwell Collins, Inc., Cedar Rapids, IA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20436 (2013.01); H05K 7/1427 (2013.01);
Abstract
A hybrid cooling approach uses both conduction and convection cooling for circuit cards. The hybrid cooling approach also isolates sensitive circuitry in the circuit cards from the ambient environment. The hybrid cooling approach uses an electronic module with a heat spreader. The heat spreader is coupled to the circuit card. The heat spreader defines openings disposed at an opposite end of a connector. The openings permit a fluid to flow within a cavity defined by the heat spreader.