The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2026

Filed:

Mar. 30, 2023
Applicants:

Yazaki Corporation, Tokyo, JP;

Toyota Jidosha Kabushiki Kaisha, Toyota, JP;

Inventors:

Teppei Doi, Makinohara, JP;

Joh Fujimoto, Makinohara, JP;

Yoku Murayama, Makinohara, JP;

Gota Murai, Toyota, JP;

Akihito Tsukamoto, Toyota, JP;

Toshiki Nunotani, Toyota, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 3/36 (2006.01); H02G 3/16 (2006.01);
U.S. Cl.
CPC ...
H05K 3/36 (2013.01); H05K 1/14 (2013.01); H02G 3/16 (2013.01);
Abstract

An electronic component module includes a first board, a second board, and an inter-board connecting portion disposed between the first and second boards and including terminal portions and a holding portion having a plurality of insertion holes into which the terminal portions are inserted. The terminal portion includes a protruding portion provided between one end and another end of the terminal portion in an insertion direction of the terminal portion into the insertion hole and protruding from the terminal portion in a direction intersecting the insertion direction. The one end and the other end of the terminal portions are electrically connected to the first and second boards, respectively. The inter-board connecting portion includes a partition wall partitioning first insertion hole and second insertion hole adjacent to each other and extending to a position in the insertion direction beyond the protruding portions of the terminal portions.


Find Patent Forward Citations

Doi, Teppei. (2026). Electronic component module (U.S. Patent No. 12604421). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12604421

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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