The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2026

Filed:

Dec. 21, 2022
Applicants:

Dupont Safety & Construction, Inc., Wilmington, DE (US);

Dupont Electronics, Inc., Wilmington, DE (US);

Inventors:

Timothy Scott Wyant, Cheektowaga, NY (US);

Gregory Scott Blackman, Media, PA (US);

James Daniel Tremel, Hockessin, DE (US);

Keith William Pollak, Youngstown, NY (US);

Fazel Zare Bidoky, Newtown Square, PA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H01Q 1/38 (2006.01); H05K 1/03 (2006.01); H05K 3/20 (2006.01); H10W 70/05 (2026.01); H10W 70/695 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H05K 3/0014 (2013.01); H05K 1/0373 (2013.01); H05K 3/207 (2013.01); H10W 70/05 (2026.01); H10W 70/695 (2026.01); H10W 90/00 (2026.01); H01Q 1/38 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0212 (2013.01);
Abstract

Electrical circuitry is produced on the surface of an organic polymer. The electrical circuitry is produced on a support, and a polymerizable composition is brought into contact with the support and the circuitry. The polymerizable composition is polymerized while in contact with support and the circuitry to produce a solid, organic polymer. The electrical circuitry becomes adhered to and partially embedded in a surface of the solid organic polymer. The support may be removed subsequent to the polymerization step to expose the circuitry at the surface of the solid organic polymer.


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