The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2026
Filed:
Dec. 23, 2021
Sony Group Corporation, Tokyo, JP;
Kanahiro Shirota, Tokyo, JP;
Keiichi Hirano, Tokyo, JP;
SONY GROUP CORPORATION, Tokyo, JP;
Abstract
Provided is a multilayer electronic substrate that includes a first substrate, a second substrate placed on the first substrate such that surfaces of the first and second substrates face each other, a first connector mounted on the surface of the first substrate and electrically connected to a first wire of the first substrate, a second connector mounted on the surface of the second substrate and electrically connected to a first wire of the second substrate, the second connector being directly connected to the first connector, and a wiring member having flexibility, the wiring member having one end electrically connected to a second wire of the first substrate and another end electrically connected to a second wire of the second substrate, to electrically connect the second wire of the first substrate and the second wire of the second substrate.