The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2026

Filed:

Jun. 08, 2022
Applicant:

Vitesco Technologies Gmbh, Regensburg, DE;

Inventors:

Detlev Bagung, Munich, DE;

Christina Quest-Matt, Munich, DE;

Holger Baldreich, Nuremberg, DE;

Assignee:

VITESCO TECHNOLOGIES GMBH, Regensburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/341 (2026.01);
U.S. Cl.
CPC ...
H05K 1/0206 (2013.01); H05K 3/0094 (2013.01); H05K 3/341 (2013.01); H05K 2201/09545 (2013.01); H05K 2201/09572 (2013.01); H05K 2201/09609 (2013.01);
Abstract

A circuit board for a power semiconductor module, having at least one top side and one bottom side, wherein at least one mounting area for a power semiconductor component is provided on the top side, wherein on the mounting area, at least one solder layer is provided for connecting at least one power semiconductor component to the mounting area, which layer is divided into regions that are separated from one another by intermediate spaces, and wherein multiple thermal vias are provided in the circuit board and extend from the top side to the bottom side of the circuit board in the region of or near the mounting area, wherein each upper opening of the thermal vias is directly surrounded by a respective region of the solder layer and each lower opening of the vias is covered by a layer of electrically insulating material.


Find Patent Forward Citations

Bagung, Detlev. (2026). Circuit board for a power semiconductor module, power semiconductor module, and method for producing a circuit board and a power semiconductor module (U.S. Patent No. 12604391). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12604391

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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