The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2026
Filed:
Jan. 23, 2024
Ersa Gmbh, Wertheim, DE;
Timon Ahlgrimm, Marktheidenfeld, DE;
ERSA GMBH, Wertheim, DE;
Abstract
A method for heating a substrate () and/or an electronic component () arranged on the substrate () for desoldering and/or soldering the component () by a soldering device () with an energy dissipation (E), a device position (P), and/or a device acceleration (a). The soldering device () heats a soldering point () on the substrate () and/or on the component () by heat conduction, heat radiation, and/or heat convection, and has a first energy dissipation (E), a first device position (P), and/or a first device acceleration (a). The soldering device () moves towards and/or away from the soldering point (), has a second energy dissipation (E), a second device position (P), and/or a second device acceleration (a). The state of the soldering point (), the substrate (), and/or the component () depends on time series of the energy dissipation (E), the device position (P), and/or the device acceleration (a).