The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2026

Filed:

May. 11, 2023
Applicant:

Toppan Inc., Tokyo, JP;

Inventor:

Junya Imamoto, Tokyo, JP;

Assignee:

TOPPAN INC., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 50/562 (2021.01); H01M 10/052 (2010.01); H01M 50/105 (2021.01); H01M 50/178 (2021.01); H01M 50/183 (2021.01); H01M 50/186 (2021.01); H01M 50/193 (2021.01); H01M 50/197 (2021.01);
U.S. Cl.
CPC ...
H01M 50/562 (2021.01); H01M 10/052 (2013.01); H01M 50/105 (2021.01); H01M 50/178 (2021.01); H01M 50/183 (2021.01); H01M 50/186 (2021.01); H01M 50/193 (2021.01); H01M 50/197 (2021.01);
Abstract

A terminal resin film of at least seven layers, with at least a layer A, a layer B, a layer C, and a layer D, and a structure being layer A, the layer B, the layer A, and the layer C or the layer D; or, the structure being layer A, the layer B, and the layer A, and Layer A: A layer formed from a resin composition including an acid-modified polyolefin resin and having an MFR of 2.0 to 50 g/10 mins; Layer B: A layer formed from a resin composition including a polyolefin resin and having an MFR of 0.05 g/10 mins or more and less than 2.0 g/10 mins; Layer C: A layer formed from a resin composition including an unmodified polyolefin resin and having an MFR of 0.05 to 50 g/10 mins; and, Layer D: An adhesive layer including a resin having a cross-linked structure.


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